Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). You may be working in a multi-user facility, as an academic or in an industrial lab. Take advantage of ZEISS Crossbeam’s modular platform concept and upgrade your system with growing needs, e.g. with the LaserFIB for massive material ablation. During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.
Spesifikasi: Advantages: Maximum sample variety due to variable pressure mode, wide range of in situ experiments. SEM: Schottky Emitter 1.7 nm @ 1 kV 1.5 nm @ 1 kV with Tandem decel 1.2 nm @ 1 kV / DCV* 1.9 nm @ 200 V with Tandem decel 0.9 nm @ 15 kV 0.7 nm @ 15 kV / DCV* 0.7 nm @ 30 kV (STEM mode) 2.3 nm @ 1 kV (WD 5 mm) 1.7 nm @ 1 kV with Tandem decel (WD 5 mm) 1.1 nm @ 15 kV (WD 5 mm) 2.3 nm @ 20 kV & 10 nA (WD 5 mm) Beam current: 5 pA – 100 nA FIB: LMIS: Lifetime: 3000 µAh Resolution: 3 nm @ 30 kV (statistical method) Resolution: 120 nm @ 1 kV & 10 pA (optional) Beam current: 1 pA – 100 nA Detectors: Inlens SE, Inlens EsB, VPSE (Variable pressure secondary electron detector), SESI (secondary electron secondary ion), aSTEM (scanning transmission electron), aBSD (backscatter detector) Chamber Size and Ports: Standard with 18 configurable ports Stage: X /Y = 100 mm Z = 50 mm, Z‘ = 13 mm T = –4° to 70°, R = 360° Repeatability: 500 nm in x/y at 0° tilt over full travel range (optional) Charge Control: Flood Gun Local Charge Compensation Variable Pressure Store Resolution:512 × 384 to 32 k × 24 k (up to 50 k × 40 k with optional Atlas 5 3D Tomography module) Analytic Options: EDS, EBSD, WDS, SIMS, others on request
ZEISS Xradia CrystalCT® computed tomography platform uniquely augments this powerful imaging technique with the ability to reveal crystallographic grain microstructures, transforming the way polycrystalline materials (such as metals, additive manufacturing, ceramics, pharmaceuticals and others) can be studied, leading to newer and deeper insights for your materials research.
ZEISS Xradia Context® micro-computed tomography (microCT) is an easy-to-use system for analysis of all types of samples. A high-array detector enables high resolution of fine details even with relatively large imaging volumes. The system features a large field of view, rapid sample mounting and alignment, streamlined acquisition workflow and fast exposure and data reconstruction times.
In XRM, contrast depends on the material being imaged and the X-ray energy used. The Xradia Ultra family comprises of Xradia 800 Ultra, operating at 8 keV photon energy, and Xradia 810 Ultra, operating at 5.4 keV. In general, lower energy X-rays are absorbed more strongly and therefore will provide you with higher contrast for most materials. Thus, as long as transmission remains sufficient, you will experience resulting image quality and/or throughput that are greatly improved with Xradia 810 Ultra.