Spesifikasi:
SEM in-chamber ultramicrotome: Dedicated high precision stage which replaces SEM stage, easy to exchange
Cutting Microtome mechanical hardware precision in Z: step size 5 nm – 200 nm, in 1 nm increment (user definable)
Minimum cut thickness achievable on biological samples: down to 25 nm (sample dependent)
Maximum cutting thickness: 200 nm
Cutting speed: 0.01 mm/sec – 6.5 mm/sec (user definable)
Typical cutting speed: 0.1 mm – 1 mm
Oscillation during cutting: available
Cutting window: > 5 mm (user definable by software)
Diamond knife size: 1.5 mm or 2.5 mm (by DiATOME)
Motorized sample Z travel range: 1.2 mm
Microtome stage X/Y travel: 2 mm × 2 mm
Maximum sample size: 1 mm × 1 mm × 1 mm
Typical block size: 600 µm × 600 µm × 600 µm
Contrast: En-bloc staining (heavy metals)
Acceleration voltage: Up to 7 kV
Optimum primary beam current: 50 pA – 1 nA
Working distance: ≤ 5 mm
System integration: Fully integrated, default settings optimized for ease of use, collision control with ZEISS hardware implemented,
Electron optics (EO) correction is applied